Riferimento 15731
SOCKET 10G 1.9W/m-k
Riferimento 15731
SOCKET 10G 1.9W/m-k
€17.43
Tax included
Ultimi pezzi in magazzino: solo 3 rimasti
Item code: 15731
Condition: New (Never opened or used)
Warranty: Until use
Spedizione sempre gratuita
Spedizione con corriere espresso in 24/48h
Spedizione con corriere espresso in 24/48h
The HY510 thermal conductive paste syringe is designed to offer effective heat dissipation between the CPU processor and the heat sink. With a thermal conductivity of 1.9W/m-K, this paste is ideal for use in high performance systems that require excellent heat management. The package contains 10 grams of dough, enough for multiple applications. It is particularly suitable for use with CPU, GPU and other electronic components that require effective heat management. Technical characteristics: Brand: HY510 Type: Thermal conductivity thermal paste: 1.9W/m-K Quantity: 10 grams Application: CPU processor, GPU, electronic components Packaging: Syringe for easy application Color: Grey Clear Condition: New
15731
3 Items
Data sheet
QUANTITA ARTICOLO
UNITA DI MISURA
CONDIZIONE
GRADO ESTETICO
GARANZIA
PAESE DI FABBRICAZIONE
TIPO
MODELLO
COLORE
MODELLO SPEDIZIONE AMAZON
New
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